KLS16-PCB-M03 manufacturer from China NINGBO KLS IMP&EXP CO.LTD.

Place of Origin:

, China (Mainland)


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Product Detail

Items	Description
Layer count	1---30 Layers
Board Thickness	Min	2 Layer : 0.20mm 4 Layer : 0.40mm 6 Layer : 0.80mm 8 Layer : 1.00mm 10 Layer : 1.20mm
	Max	6.35mm
Base Copper Weight	Min	17um(1/2oz)
	Max	140um(4 oz) for inner layer 210um(6 oz) for outter layer
Laminates Types	FR-4(High Tg,Halogen Free),FR-5,FR-1,CEM-1, CEM-3,BT,Getek Isola,Rogers,Aluminium
Max Panel Size	508mm X 610mm ( 20" x 24" )
Min Finished Hole Size	0.20mm ( 8mil )
PTH Wall Thickness	0.025mm ( 1mil )
Aspect Ratio	8 : 1
Min Line Width/Space	0.075mm/0.075mm ( 3mil / 3mil )
Via Hole Type	Via Hole Type
HDI/Microvia	Yes
Surface Finish	HASL, Lead Free HASL, Immersion Tin Flash Gold (Gold plating ), Immersion Gold Slect Gold plating (gold thickness up to 120u") Gold Finger, Immersion Silver, OSP/ENTEK Carbon Ink, Peelable Mask
Solder Mask	Green, Blue, Black, Red, White, Yellow Liquid Photo-Image ( LPI ), Dry Film Min S/M pitch: 0.10mm
Impedance Control	±10% ( min 50 ohm )
Min Bonding Pitch	0.181mm ( center to center )
Min SMT Pitch	0.400mm ( center to center )
Min Annual Ring	0.025mm
Outline Finish Types	CNC Routing, Tooling Punching, V-Scoring/Cut
Tolerance	PTH Hole Dia.Tolerance :　± 0.075mm (3mil) NPTH Hole Dia.Tolerance :　± 0.05mm (2mil) Hole Position Deviation :　± 0.05mm (2mil) Board Thickness (0.2-1.0mm) : 　± 15% Board Thickness (1.2-6.35mm) :　± 15% Routed Outline Tolerance :　± 0.10mm (4mil) Punched Outline Tolerance :　± 0.20mm (8mil)
Thermal Stress	Thermal Stress
Warp & Twist	≤0.7%
Test Voltage	50V---300V
Current Breakdown	10A
Peel Strenth	1.4N /mm
Soldermask abrasion	>6H